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99.7% Alumina Wafer Polish Plate

Tlhaloso e Khutšoanyane:

Chemshun 99.7% Al2O3 Alumina substrate e le thepa ea bohloeki bo phahameng le boholo bo boholo bo ncha, e na le thepa e ntle ea 'mele le litlhaku tse tsitsitseng tsa lik'hemik'hale, theko e ntle e bapisoa le lisebelisoa tse ling.Alumina e hloekileng e lula e tsoela pele ho ntlafatsoa ke lipatlisiso tse holimo tsa lefats'e le lirafshoa tse tsoetseng pele le lifeme tse ntle tsa ceramic.

99.7% Alumina Wafer Polishing Plate bakeng sa ho Pholisa Mochini oa Lik'hemik'hale.E le karolo ea bohlokoa ea ts'ebetso ea ho belisoa ha mochini oa lik'hemik'hale tsa CMP.CMP ke e hlokahalang bakeng sa ho hlahisa ts'ebetso ea safire le Wafer ea li-semiconductors.

Bohloeki bo phahameng ba Chemshun Ceramics 99.7 % alumina ceramics e bentšang le lipoleiti tsa safire, Disc e bōpehile joalo ka mokhoa oa tlhahiso ea PIBM.Ke theknoloji e tsoetseng pele ea ka hare.PIBM e atlehile ho rarolla bothata ba bohlokoa ba ho phatloha le ho senyeha ha lisebelisoa tse kholo tsa alumina ceramics.Theknoloji ea PIBM e tla bula fensetere e 'ngoe ea li-ceramics tse ntle.


Lintlha tsa Sehlahisoa

Kopo

Joalo ka Alumina ceramic wafer polishing le sapphire lapping disks tse sebelisoang ho semi-conductive, ho bentša taemane jj.

Tshebetso: Mefuta eohle ea mokhoa oa ho belisa le oa ho roala, joalo ka CMP chemical polishing mechanical polishing, Mechanical polishing, Precision Polishing.

Sebopeho

Bohloeki bo phahameng le ho tšoarella ha lik'hemik'hale
Matla a Mechane a Phahameng le ho Thatafala
High Corrosion Resistance
High Voltage Resistance
E Hanela Mocheso o Holimo Ho fihla ho 1700ºC
Ts'ebetso e Feteletseng ea Abrasion Resistance
Ts'ebetso e Ntle ea Insulation
Mefuta eohle ea Size 180,360, 450, 600mm joalo-joalo

Lebitso la sehlahisoa 99.7 bohloeki bo phahameng Alumina ceramic Polishing Lapping Discs
Lintho tse bonahalang 99.7% alumina
Boholo bo Tloaelehileng D180, 360, 450, 600mm, boholo bo hlophisitsoeng bo amoheloa.
Mmala Lenaka la tlou
Kopo Ts'ebetso ea Wafer le Sapphire CMP indastering ea semi-conductive
Min.Order 1Pic

Boitsebiso ba lik'hemik'hale / 'mele

Yuniti 99.7 Alumina Ceramics
Kakaretso Thepa Likahare tsa Al2O3 wt% 99.7-99.9
Botenya gm/cc 3.94-3,97
Mmala - Lenaka la tlou
Ho monya metsi % 0
Thepa ea Mechini Flexural Strength(MOR) 20 ºC Mpa(psix10^3) 440-550
Elastic Modulus 20ºC GPA (psix10^6) 375
Vickers Hardness Gpa(kg/mm2) R45N >>=17
Matla a Kobehang GPA 390
Matla a Tensile 25ºC MPa(psix10^3) 248
Fracture Toughness (KI c) Mpa* m^1/2 4-5
Thermal Properties Thermal conductivity(20ºC) W/mk 30
Coefficient of Thermal extension(25-1000ºC) 1x 10^-6/ºC 7.6
Thermal Shock Resistance ºC 200
Boholo ba mocheso oa tšebeliso ºC 1700
Thepa ea Motlakase Matla a Dielectric (1MHz) ac-kv/mm(ac v/mil) 8.7
Dielectric Constant(1 MHz) 25ºC 9.7
Ho hanyetsa Molumo ohm-cm (25ºC) >10^14
ohm-cm (500ºC) 2×10^12
ohm-cm (1000ºC) 2×10^7

Tshebeletso

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