Joalo ka Alumina Substrate bakeng sa phanele ea LCD (PFD, PDF, TFT…) lisebelisoa tsa tlhahiso.
Bakeng sa indasteri e kholo ea LCD khalase ea substrate manipulator.
Bakeng sa lisebelisoa tsa lithography.
Bohloeki bo phahameng le ho tšoarella ha lik'hemik'hale
Matla a Mechane a Phahameng le ho Thatafala
High Corrosion Resistance
High Voltage Resistance
Mocheso o Holimo Ho fihla ho 1700ºC
Ts'ebetso e Feteletseng ea Abrasion Resistance
Ts'ebetso e Ntle ea Insulation
Boholo bo boholo
Lebitso la sehlahisoa | Chemshun boholo bo boholo bo hloekileng bo phahameng Alumina ceramic substrate ceramic panel |
Lintho tse bonahalang | 99.7% alumina |
Boholo bo Tloaelehileng | 1200x500x20, 1400x900x30, boholo bo ikhethileng bo amoheloa. |
Mmala | Lenaka la tlou |
Kopo | LCD panel (PFD, PDF, TFT ...) lisebelisoa tsa tlhahiso. |
Min.Order | 1Pic |
Yuniti | 99.7 Alumina Ceramics | ||
Kakaretso Thepa | Likahare tsa Al2O3 | wt% | 99.7-99.9 |
Botenya | gm/cc | 3.94-3,97 | |
Mmala | - | Lenaka la tlou | |
Ho monya metsi | % | 0 | |
Thepa ea Mechini | Flexural Strength(MOR) 20 ºC | Mpa(psix10^3) | 440-550 |
Elastic Modulus 20ºC | GPA (psix10^6) | 375 | |
Vickers Hardness | Gpa(kg/mm2) R45N | >>=17 | |
Matla a Kobehang | GPA | 390 | |
Matla a Tensile 25ºC | MPa(psix10^3) | 248 | |
Fracture Toughness (KI c) | Mpa* m^1/2 | 4-5 | |
Thermal Properties | Thermal conductivity(20ºC) | W/mk | 30 |
Coefficient of Thermal extension(25-1000ºC) | 1x 10^-6/ºC | 7.6 | |
Thermal Shock Resistance | ºC | 200 | |
Boholo ba mocheso oa tšebeliso | ºC | 1700 | |
Thepa ea Motlakase | Matla a Dielectric (1MHz) | ac-kv/mm(ac v/mil) | 8.7 |
Dielectric Constant(1 MHz) | 25ºC | 9.7 | |
Ho hanyetsa Molumo | ohm-cm (25ºC) | >10^14 | |
ohm-cm (500ºC) | 2×10^12 | ||
ohm-cm (1000ºC) | 2×10^7 |
Re amohela litaelo tsa tloaelo.
Haeba u batla ho tseba haholoanyane ka sehlahisoa, ka kopo ikutloe u lokolohile ho ikopanya le rona 'me re tla u fa sehlahisoa se loketseng le tšebeletso e ntle ka ho fetisisa!